Other Resources

Below are compiled outside resources that we reference often.

LFI

Strong light pulses turn out to have the ability to ionize the semiconductor region, which leads to a localized fault.

The Hardware Hacking Handbook pg 178

Decapsulation

The process of removing some of the IC packaging material using chemical warfare, usually by dripping fuming nitric or sulfuric acid onto the chip package until it dissolves.

The Hardware Hacking Handbook pg 18

Voltage Glitch

...to abruptly shift the voltage, raising or lowering it for such a brief moment that the chip does not crash but it also doesn't execute its instruction properly.

Microcontroller Exploits pg 135

...to create a stable power supply for the chip, except at the moment of a significant operation when it should be dropped or spiked to outside the normal operating voltage range.

The Hardware Hacking Handbook pg 159

Delayer

Polishing off the chip's individual metal layers to expose the one below it.

The Hardware Hacking Handbook pg 19

Clock Glitch

...inserting a short clock pulse, one single edge or cycle that is far above the maximum rate of the chip.

Microcontroller Exploits pg 134

...to insert a rogue, too-narrow, or too-wide clock edge.

The Hardware Hacking Handbook pg 148

Fault Injection

Introducing faults into a target to alter its intended behavior

Raelize TAoFI slideshow

...the practice of pushing hardware to a point that induces processing errors

The Hardware Hacking Handbook pg 13

EMFI

...uses a strong electromagnetic pulse to cause a fault.

The Hardware Hacking Handbook pg 171

Depackaging

...dunk[ing] the whole package in acid, after which the entire chip is laid bare.

The Hardware Hacking Handbook pg 18

Rebonding

...reattaching the tiny wires that normally connect the chip to the pins of a package.

The Hardware Hacking Handbook pg 18

OFI

Strong light pulses turn out to have the ability to ionize the semiconductor region, which leads to a localized fault.

The Hardware Hacking Handbook pg 178